Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1995-03-13
1997-09-23
Ramsey, Kenneth J.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
B23K 118
Patent
active
056695462
ABSTRACT:
A semiconductor device is manufactured by a jig. The jig includes a pair of flat heat spreading devices with flat heaters, and an enclosing device for surrounding an assembly of the semiconductor device situated between the heat spreading devices. An assembly of the semiconductor device includes a common electrode plate, semiconductor chips placed above the common electrode, metal contact terminal plates placed above the semiconductor chips, and solder sheets placed at least a portion between the semiconductor device and the common electrode and a portion between the semiconductor chip and the contact terminal plate. The assembly is held between the heat spreading devices, and a reducing gas is supplied to isolate the assembly from atmosphere. The heater plates attached to the heat spreading plates is heated to uniformly heat the solder sheets at a predetermined temperature, and the heater plates are pressed vertically at a predetermined temperature to bond the semiconductor chips to the common electrode plate or to the metal contact terminal plates under pressure. Thus, the heights of the metal contact terminal plates are aligned uniformly.
REFERENCES:
patent: 4892245 (1990-01-01), Dunaway et al.
patent: 5261157 (1993-11-01), Chang
Patent Abstracts of Japan, Vol. 10, No. 309(E-447)(2365), Oct. 21, 1986, JP61-123163, Mitsubishi Electric Corp.
Fuji Electric & Co., Ltd.
Ramsey Kenneth J.
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