Apparatus for manufacturing printed wiring board and method...

Details Apparatus for manufacturing printed wiring board and method... Apparatus for manufacturing printed wiring board and method...

2005-07-19

2005-07-19

Hassanzadel, P. (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C118S718000, C138S037000

Reexamination Certificate

active

06918989

ABSTRACT:
In a manufacturing apparatus of printed wiring board an aperture of a nozzle pipe located in a central position is larger than that at both sides, or the aperture of the piping to the nozzle pipe in the central position is larger than that of the piping at both sides. The mutual interval is narrower with the central nozzle pipes. The interval of the individual nozzle pipes is variable, and is also variable in the vertical direction. A pressure-proof flexible tube is provided between each nozzle pipe and the pump, and the interval of the individual nozzle pipes is variable, and is also variable in the vertical direction. Further, the spray pressure, oscillating angle, and oscillating speed can be set individually in each nozzle pipe, and such setting can be automated.

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