Apparatus for manufacturing non-resonance knock sensor

Details Apparatus for manufacturing non-resonance knock sensor Apparatus for manufacturing non-resonance knock sensor

2005-02-08

2005-02-08

Trinh, Minh (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S739000, C029S729000, C029S783000, C029S793000, C029S430000, C029S593000, C029S025350

Reexamination Certificate

active

06851181

ABSTRACT:
An apparatus of two stories for manufacturing a non-resonance knock sensor has an assembly body stage positioned at a first floor for forming an assembly body in which a lower insulator, a lower terminal plate, a piezoelectric element, an upper terminal plate and an upper insulator are mounted on a cylindrical base, and process stages positioned at a second floor for fastening the assembly body with a nut to form a sensor main body, bending partly the lower and upper terminal plates of the sensor main body and connecting by welding a resistor between the lower and upper terminal plates which are partly bent in the sensor main body. Accordingly, its manufacturing line is compact and can be installed in smaller horizontal ground area.

REFERENCES:
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patent: 5575053 (1996-11-01), Ishida et al.
patent: 5727301 (1998-03-01), Kugo
patent: 20030029028 (2003-02-01), Watanabe et al.
patent: 7-218331 (1995-08-01), None
patent: 8-155761 (1996-06-01), None
patent: 200357107 (2003-02-01), None

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