Apparatus for manufacturing interconnects with fine lines and fi

Details Apparatus for manufacturing interconnects with fine lines and fi Apparatus for manufacturing interconnects with fine lines and fi

1991-05-17

1992-12-01

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156634, 156645, 156656, 156902, 1566591, B44C 122, C23F 100

Patent

active

051677474

ABSTRACT:
An apparatus for producing fine line printed circuits, with fine spacing between lines, includes a pad structure which can be vibratedly moved across the surface of a laminate to be etched. Etchant solution is provided in a uniform manner across the face of the pad structure as a result of the combination of the layout of the face of the pad, the support materials, and the orientation of an etchant distribution system.

REFERENCES:
patent: 2446443 (1948-08-01), Tibbetts
patent: 2968056 (1961-01-01), Aveni
patent: 3411973 (1968-11-01), Siler
patent: 3549439 (1970-12-01), Kaveggia et al.
patent: 4376009 (1983-03-01), Kunz
patent: 4451327 (1984-03-01), Nelson
patent: 5024735 (1991-06-01), Kadija
J. Chem. Soc., (1929), pp. 1870-1873 (Chem. Abs., vol. 24, p. 77).
J. Chem. Soc. (1927), pp. 1113-1122.
WO 90/09976 International Publication (PCT Application PCT/US 90/01081).
Zh. Org. Khim (1971), vol. 7, part 12, pp. 2567-2569 (Chem. Abs. 76 72171Y).

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