Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Means assembling part within hole or aperture
Patent
1997-03-31
2000-05-09
Maki, Steven D.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Means assembling part within hole or aperture
156559, 156578, B29C 6502, B29C 6554
Patent
active
060590009
ABSTRACT:
A method and an apparatus for manufacturing a bead filter for eliminating electromagnetic interference noises generated in electronic apparatuses are disclosed. The present invention improves an adhesive manufacturing process, an adhesive applying process and an adhesive drying process, so that the radial bead filters of the present invention having superior electromagnetic characteristics would be minimally affected by the adhesive, and superior bonding strengths of the radial bead filters can be maintained. The method for manufacturing the bead filter composed of a lead wire and a pair of ferrite cores for eliminating electromagnetic interferences in electronic apparatuses, includes the step of mixing 10-40 wt % of an epoxy powder and 60-90 wt % of benzyl alcohol so as to prepare an epoxy resin gel. With this epoxy resin gel, the bead filters are continuously manufactured with a simple process.
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Maki Steven D.
Samsung Electro-Mechanics Co. Ltd.
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