Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-12-20
2008-08-12
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S108000, C438S125000, C438S907000, C257SE21001
Reexamination Certificate
active
07410826
ABSTRACT:
A mounting zone and a reflow zone are arranged in parallel between a loader and an unloader, and mounting and reflow processes are performed simultaneously.
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Geyer Scott B.
Harness & Dickey & Pierce P.L.C.
Roman Angel
Seiko Epson Corporation
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