Apparatus for manufacturing an electronic device, method of...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor

Reexamination Certificate

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Details

C438S108000, C438S125000, C438S907000, C257SE21001

Reexamination Certificate

active

07410826

ABSTRACT:
A mounting zone and a reflow zone are arranged in parallel between a loader and an unloader, and mounting and reflow processes are performed simultaneously.

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Two communications from Japanese Patent Office re: related applications.
Communication from Korean Patent Office re: countepart application.

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