Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With printing
Patent
1998-12-18
2000-12-26
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With printing
156498, 156513, 156514, 156582, 1565831, 156584, 118 50, 118213, B32B 3116, B32B 3120
Patent
active
061643572
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to an apparatus for manufacturing adhesive layers for use in double-sided substrates and multilayer substrates for use in a variety of electronic apparatuses, an apparatus for manufacturing the double-sided substrates and an apparatus for manufacturing the multilayer substrates.
BACKGROUND ART
Hitherto, an apparatus for manufacturing double-sided substrates and multilayer substrates for use in electronic apparatuses usually has a structure as shown in FIG. 12.
The apparatus incorporates a pattern forming portion 100 for forming a predetermined electrically-conductive patterns 108 and 109 on electrically-conductive foil 107 of a double-sided copper applied plate 106; a multilayer laminating portion 101 for bonding, through prepreg 111, another double-sided substrate or electrically-conductive foil 112 to the two sides of a double-sided substrate 110 formed by the pattern forming portion 100; a resin hardening portion 102 for hardening resin of the prepreg 111; a hole machining portion 103 for forming a hole 113 in a multilayer laminated substrate formed by the resin hardening portion 102; a through-hole plating portion 104 for forming an electrically-conductive layer 114 on the inner surface of the formed hole and the two sides of the multilayer laminated substrate; and an outer-layer-pattern forming portion 105 for forming a predetermined electrically-conductive pattern 115 on the outermost layer. After the above-mentioned processes have been performed, a predetermined multilayer substrate 116 can be manufactured.
However, the double-sided substrate and the multilayer substrate must be finer substrates exhibiting a raised mounting efficiency. Also from another viewpoint of the environment, an apparatus for manufacturing double-sided substrates, that for manufacturing multilayer substrates and that for manufacturing adhesive layers for the foregoing substrates have been required such that each apparatus does not require a plating process.
An object of the present invention is to provide an apparatus for manufacturing adhesive layers which are finer, which exhibit an excellent mounting efficiency, which do not require any plating process and which are manufactured by clean manufacturing processes, an apparatus for manufacturing double-sided substrates and an apparatus for manufacturing multilayer substrates.
DISCLOSURE OF THE INVENTION
An apparatus for manufacturing an adhesive layer according to the present invention comprises: a bonding portion for bonding a film member to prepreg; a hole machining portion for forming a hole at a predetermined position of a laminate composed of the prepreg and the film member; a charging portion for charging electrically-conductive paste into the formed hole of the laminate composed of the prepreg and the film member; and a separating portion for separating the film member from the laminate having the hole into which the electrically-conductive paste has been charged.
As a result of the above-mentioned structure, a fine manufacturing process can be provided which exhibits an excellent mounting efficiency and which does not require any plating process.
BRIEF DESCRIPTION OF DRAWINGS
FIG. 1 is a diagram showing the overall process of a first embodiment of an apparatus for manufacturing adhesive layers, double-sided substrates and multilayer substrates according to the present invention;
FIG. 2 is a diagram showing the structure of a bonding portion according to the first embodiment of the present invention;
FIG. 3(a) is a perspective view showing a separation-start forming portion of the bonding portion according to the first embodiment of the present invention; and
FIG. 3(b) is a cross sectional view showing a laminate formed by the separation-start forming portion;
FIG. 4(a) is a diagram showing the structures of a cutting portion and an end-surface cutting portion according to the first embodiment of the present invention;
FIG. 4(b) is a perspective view showing a laminate formed by the cutting portion and the end-sur
REFERENCES:
patent: 4747211 (1988-05-01), Gilleo et al.
patent: 4897148 (1990-01-01), Orlandi
Hayashi Hidenori
Kato Kanji
Ochi Akio
Tanizaki Toshio
Wada Akira
Ball Michael W.
Matsushita Electric - Industrial Co., Ltd.
Tolin Michael A
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