Apparatus for manufacturing a multilayer chip capacitor

Metal working – Means to assemble or disassemble – Means to assemble electrical device

Reexamination Certificate

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Details

C029S729000, C029S739000, C029S840000, C228S180100

Reexamination Certificate

active

07975371

ABSTRACT:
The present invention carries out the vacuum deposition by setting a deposition angle between a single mask set including a shadow mask having a plurality of slits and a deposition source to form a lower terminal layer, a dielectric layer, an inner electrode layer, and an upper terminal layer at once under a vacuum state generated once, or adjusts slit patterns by relatively moving upper and lower mask sets that respectively include shadow masks having a plurality of slits and face each other to form a lower terminal layer, a dielectric layer, an inner electrode layer, and an upper terminal layer at once under a vacuum state generated once.

REFERENCES:
patent: 5048163 (1991-09-01), Asmus et al.
patent: 5144747 (1992-09-01), Eichelberger
patent: 6092269 (2000-07-01), Yializis et al.
patent: 6-13258 (1994-01-01), None
patent: 2002-93658 (2002-03-01), None

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