Apparatus for making wire connections on semiconductor chips

Details Apparatus for making wire connections on semiconductor chips Apparatus for making wire connections on semiconductor chips

1997-04-17

1999-04-13

Heinrich, Samuel H.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 55, 403 72, 403220, H05K 1306

Patent

active

058935096

ABSTRACT:
In an apparatus known as a wire bonder, a new type of one-piece joint element (20) is used as the articulated link (G) between a support unit (pivoting rocker 30) and a bonding unit (10) that carries a capillary (12). One or more such joint elements (20) define a virtual pivot axis (A2) for the unit (10), which lies outside the unit and thus provides a passage in the apparatus wide enough for relatively wide workpieces (chips 1 on substrate 2). A joint element (20a) is made in one piece and has at least two elastically flexible blades (22a) converging toward each other relative to a symmetry plane (S), and the blades are connected to each other by two rigid sections (23a, 24a). One of the rigid sections (23a) is attached to (and removable from) the support unit (30), the other (24a) is attached to (and removable from) the bonding unit (10), so that the joint element (20) is easy to fit or exchange.

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