Apparatus for making circuitized substrates having...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S852000, C029S831000, C430S311000, C430S315000

Reexamination Certificate

active

07827682

ABSTRACT:
Apparatus and method for making circuitized substrates using a continuous roll format in which a layer of conductor is fed into the apparatus, layers of photo-imageable dielectric are applied to opposite sides of the conductor layer, thru-holes are formed through the composite, and then metal layers are added over the dielectric and then patterns (e.g., circuit) are formed therein. Several operations are performed in addition to these to form the final end product, a circuitized substrate (e.g., printed circuit board), all while the conductor layer of the product is retained in a solid format, up to the final separation from the continuous layer.

REFERENCES:
patent: 4372800 (1983-02-01), Oizumi et al.
patent: 4557784 (1985-12-01), Uekita et al.
patent: 4579612 (1986-04-01), Held
patent: 4659425 (1987-04-01), Eggers et al.
patent: 4902610 (1990-02-01), Shipley
patent: 5026624 (1991-06-01), Day et al.
patent: 5153986 (1992-10-01), Brauer et al.
patent: 5300402 (1994-04-01), Card, Jr. et al.
patent: 6015520 (2000-01-01), Appelt et al.
patent: 6073344 (2000-06-01), Japp et al.
patent: 6175087 (2001-01-01), Keesler et al.
patent: 6188027 (2001-02-01), Miller et al.
patent: 6204453 (2001-03-01), Fallon et al.
patent: 6349871 (2002-02-01), Card, Jr. et al.
patent: 6388202 (2002-05-01), Swirbel et al.
patent: 6388204 (2002-05-01), Lauffer et al.
patent: 6391210 (2002-05-01), Appelt et al.
patent: 6479093 (2002-11-01), Lauffer et al.
patent: 6493861 (2002-12-01), Li et al.
patent: 6495239 (2002-12-01), Bhatt et al.
patent: 6500349 (2002-12-01), Andresakis et al.
patent: 6521844 (2003-02-01), Fuerniss et al.
patent: 6626106 (2003-09-01), Peckham et al.
patent: 6626196 (2003-09-01), Downes, Jr. et al.
patent: 6628531 (2003-09-01), Dadafshar
patent: 6630630 (2003-10-01), Maezawa et al.
patent: 6630743 (2003-10-01), Magnuson et al.
patent: 6631558 (2003-10-01), Burgess
patent: 6631838 (2003-10-01), Kim et al.
patent: 6638690 (2003-10-01), Meier et al.
patent: 6638858 (2003-10-01), Cheng
patent: 6750405 (2004-06-01), Fallon et al.
patent: 7328502 (2008-02-01), Lauffer et al.
patent: 2002/0045294 (2002-04-01), Barrett et al.

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