Apparatus for making bondable finger contacts

Details Apparatus for making bondable finger contacts Apparatus for making bondable finger contacts

1979-07-11

1980-08-05

Drummond, Douglas J.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With separate heating means for work

156510, 156554, 156555, 156578, B32B 3100, B31F 500, B65C 1104

Patent

active

042160510

ABSTRACT:
Apparatus is disclosed for making bondable finger contacts (101) for application to printed circuit boards. The finger contacts are formed from a thin strip (102) of electrically conductive material. Following the application of a thin layer of contact metal (201) to the contact area, a strip of adhesive tape (109) is applied to the plated side of the contacts to protect the contacts, to interconnect and support them during subsequent handling, and to provide a compliant surface which aids in the application of the contacts to a circuit board. On an opposite side of the contacts there is applied a thermally curable adhesive (301) which, when brought into pressure contact with the circuit board and a moderate amount of heat is applied, will fasten the contacts to the board.

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