Apparatus for localized planarization of semiconductor wafer sur

Details Apparatus for localized planarization of semiconductor wafer sur Apparatus for localized planarization of semiconductor wafer sur

1998-05-15

2000-12-26

Eley, Timothy V.

Abrading

Machine

Rotary tool

451290, B24B 2900

Patent

active

061650579

ABSTRACT:
Apparatus for selectively polishing an elevated area of the surface of a semiconductor wafer. The apparatus makes a topographical map of the surface of a semiconductor wafer to identify a high area on the surface; positions polishing apparatus over and in contact with the elevated area; and, moves the polishing apparatus and/or the wafer to polish selectively only the elevated area of the wafer surface.

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