Apparatus for laser cutting wiring in accordance with a measured

Details Apparatus for laser cutting wiring in accordance with a measured Apparatus for laser cutting wiring in accordance with a measured

1994-05-05

1997-09-23

Evans, Geoffrey S.

Electric heating

Metal heating

By arc

21912183, B23K 2602, H05K 302

Patent

active

056700679

ABSTRACT:
An apparatus for cutting a wiring on a printed wiring board using a laser beam includes a laser oscillator for emitting a laser beam along a main optical path, a multiaxis positioning apparatus for changing the three-dimensional coordinates of a printed wiring board, an X-Y adjustment apparatus for adjusting two-dimensional coordinates, perpendicular to the main optical path, an apparatus for optically measuring a size of a wiring to be cut, and a control apparatus for controlling beam parameters of the laser beam in accordance with the measured size.

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Patent Abstract of JP E-1322, Feb. 19, 1993, vol. 17, No. 85.
Automated Visual Inspection, B.G. Batchelor, D.A. Hill, D.C. Hodgson, IFS, Ltd., UK, 1985 pp. 295-321.
A Pattern Inspection System for High-Density Printed Wiring Boards, Katsumi Fujihara et al., Fujitsu Sci. Tech, J., 31,1, pp. 23-31, Jun. 1994.
Translated Office Action from German Patent Office dated Aug. 17, 1995 citing above listed references.

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