Apparatus for lapping semiconductor wafers and method of lapping

Details Apparatus for lapping semiconductor wafers and method of lapping Apparatus for lapping semiconductor wafers and method of lapping

1997-07-24

2000-04-25

Utech, Benjamin L.

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

H01L 21302

Patent

active

060543884

ABSTRACT:
To provide a semiconductor wafer lapping method capable of preventing deformation of a press platen caused by repeating lapping and improving deterioration of TTV caused by rotation stop of semiconductor wafers. In a semiconductor wafer lapping method comprising the steps of placing a lapping carrier having holding holes loaded with semiconductor wafers between an upper press platen and a lower press platen which rotate in opposite directions, rotating the lapping carrier, and lapping the semiconductor wafers, the rotation speed of the lapping carrier is abruptly changed to induce rotation of the semiconductor wafers in the holding holes of the lapping carrier.

REFERENCES:
patent: 4773185 (1988-09-01), Taira
patent: 5099614 (1992-03-01), Arai et al.
patent: 5159787 (1992-11-01), Suenaga et al.
patent: 5364655 (1994-11-01), Nakamura et al.
patent: 5679055 (1997-10-01), Green et al.
patent: 5800725 (1998-09-01), Kata et al.
patent: 5821167 (1998-10-01), Fukami et al.

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