Apparatus for lapping or polishing materials

Details Apparatus for lapping or polishing materials Apparatus for lapping or polishing materials

1977-12-15

1979-08-28

Whitehead, Harold D.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51216R, B24B 722

Patent

active

041655842

ABSTRACT:
Wafers to be processed are mounted to a lapping plate of a lapping machine using a photosensitive thermoplastic material, such as a photoresist. In a preferred embodiment, the wafers are laminated to a dry film photopolymer disposed on a carrier sheet, after which the sheet is secured to the lapping plate using a pressed-fit hoop that stretches the carrier sheet across the surface of the lapping plate and holds the sheet secure about the perimeter of the plate.

REFERENCES:
patent: 2142057 (1938-12-01), Hulbert et al.
patent: 2772521 (1956-12-01), Voytech
patent: 3448510 (1969-06-01), Bippus et al.
patent: 3518798 (1970-07-01), Boettcher
patent: 3562057 (1971-02-01), McAlister et al.
patent: 3727282 (1973-04-01), Neary

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