Apparatus for laminating multilayered printed circuit boards hav

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Chamber enclosing work during bonding and/or assembly

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156580, 1565833, B32B 3100

Patent

active

049868705

ABSTRACT:
A method and apparatus for laminating multilayer printed circuit boards having both rigid and flexible portions. The multilayers of a multilayer printed circuit board are positioned on a lower lamination plate which rests on a bleeder plate which itself rests on a vacuum plate. The circuit layers are then covered with another steel plate, a sheet of silicon material, a breather blanket and a plastic vacuum bag which is hermetically sealed to the vacuum plate using a silicon sealing material. The vacuum plate and the components thereon are positioned within a pressure vessel, a vacuum line is connected to the vacuum plate and the multiple layers of the multilayer printed circuit board are laminated within the pressure vessel.

REFERENCES:
patent: 2267721 (1941-12-01), Elmendorf
patent: 3433699 (1969-03-01), Rumble
patent: 3493451 (1970-02-01), Beery
patent: 3818823 (1974-06-01), Bond
patent: 3852136 (1974-12-01), Plumat et al.
patent: 4300978 (1981-11-01), Whitemore
patent: 4421589 (1983-12-01), Armini et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for laminating multilayered printed circuit boards hav does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for laminating multilayered printed circuit boards hav, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for laminating multilayered printed circuit boards hav will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1553463

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.