Apparatus for laminating multilayered printed circuit boards

Details Apparatus for laminating multilayered printed circuit boards Apparatus for laminating multilayered printed circuit boards

1984-05-02

1986-06-24

Kimlin, Edward

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Chamber enclosing work during bonding and/or assembly

156497, 156285, B32B 3100

Patent

active

045966249

ABSTRACT:
An apparatus for laminating multilayered printed circuit boards while radically reducing the volume of inert gas that must otherwise be used to effect the lamination process. The invention employs a novel ring assembly, each such assembly disposed on a moveable, horizontally disposed shelf. Each such ring assembly comprises a hollow circular cylinder, the interior of which is adapted to radially enclose a multiple layer circuit module mounted on a heating platen. The axial surfaces of the cylinder are capped by a pair of seal plates and O-rings to form a gas-tight laminating chamber. Each shelf is adapted to travel vertically along a pair of support tubes whereby the entire array of shelves may be compressed relative to the respective shelves by a hydraulic or pneumatic cylinder the rod of which is affixed to the bottom surface of the lowermost shelf.

REFERENCES:
patent: 1590296 (1926-06-01), Klein et al.
patent: 2952145 (1960-09-01), Thompson
patent: 4127436 (1978-11-01), Friel
patent: 4234373 (1980-11-01), Reavill et al.
patent: 4407685 (1983-10-01), Hankland
patent: 4431471 (1984-02-01), Mertens et al.

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