Apparatus for laminating and circuitizing substrates having open

Details Apparatus for laminating and circuitizing substrates having open Apparatus for laminating and circuitizing substrates having open

1995-06-06

1996-11-26

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174252, 361761, 361764, 361794, 361792, H05K 118, H05K 102

Patent

active

055787967

ABSTRACT:
According to the present invention, a method of laminating at least two substrates together and circuitizing at least one surface of the laminate is provided. Pressure is exerted against opposite surfaces of each of said two substrates. An opening extends from a circuit-receiving surface of at least one of said substrates. A plug is provided which is configured to removably fit into said opening and has a support surface thereon which is substantially coplanar with the circuit-receiving surface when said plug is positioned in the opening. The plug is inserted in the opening with the support surface substantially coplanar with the circuit-receiving surface. The substrates are laminated by application of pressure on the opposite surfaces of the substrates. The circuit-receiving surface and the support surface are covered with a sheet of dry film photoresist to seal around the opening with said plug member supporting said sheet of photoresist in the region of the opening. The dry film resist material is patterned and developed in a predetermined pattern, and the surface is circuitized with electrical circuitry. Any remaining photoresist is stripped, and said plug member is removed.

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"IBM Technical Disclosure Bulletin," vol. 27, No. 2; Jul., 1984; p. 1139.

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