Apparatus for joining substrates together

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With work feeding or handling means

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C156S556000, C269S053000, C029S238000, C029S281600

Reexamination Certificate

active

06814125

ABSTRACT:

BACKGROUND OF THE INVENTION
The present invention relates to an apparatus for joining together at least two substrates, each of which has an inner hole, with the apparatus having a pin that is adapted to the inner holes of the substrates.
Many data carriers, such as DVD's, are generally comprised of two substrates that are glued together and that for the gluing are joined together in a centered manner. In so doing, generally a first substrate that is provided with an adhesive coating is placed upon a planar support and subsequently a second substrate is moved over the first substrate by means of a handling apparatus and hence the substrates are brought together. In this connection, the handling apparatus must not only be in a position to precisely orient these substrates relative to one another, but also to uniformly press the substrates together. However, such a handling apparatus is very complicated and expensive, and is susceptible to disruptions, which leads to irregularities during the joining together and adversely affects the functioning of the data carrier and can even make it unusable.
U.S. Pat. No. 5,888,433 discloses an apparatus of the aforementioned type for joining two substrates together. The apparatus provided with an expandable centering boss that is comprised of three individual parts. The centering boss is introduced into the central hole of a substrate that is comprised of two glued-together substrate halves, and the boss is subsequently radially expanded. Due to the expansion, a centering of the two substrate halves results, after which they are glued together. This subsequent centering has a danger that the substrate halves can be damaged, since the force applied to the substrate halves must be relatively high in order to move the substrates relative to one another after the gluing.
Proceeding from the above-described apparatus, it is an object of the present invention to provide a simple and economical apparatus for joining substrates together, with such apparatus enabling a reliable and precise joining together with a low reject rate.
SUMMARY OF THE INVENTION
Pursuant to the present invention, with an apparatus for joining together at least two substrates, each of which has an inner hole, and which apparatus has a pin that is adapted to the inner holes of the substrates, this object is realized in that the pin has at least two noses that are movable radially relative to the pin, wherein the edges of the inner holes of the substrates glide downwardly on the straight or linear outer surfaces of the noses during movement of the noses toward the pin. The pin makes it possible during the joining together for the substrates to be guided precisely centrally and parallel to one another. In particular, due to the linear outer surfaces of the noses, the substrates are held such that their faces are parallel to one another, and the linear outer surfaces, during the joining together, provide a constant movement sequence. Due to the use of the pin, the requirements made of a handling apparatus can be significantly reduced, so that the costs associated therewith are eliminated.
Pursuant to a particularly preferred specific embodiment of the invention, prior to the joining together, the noses keep the substrates spaced apart, so that they are placed upon the pin and can subsequently be transported into a joining station in which they are joined together. The pin is advantageously a centering pin, that at least in the lower region has an outer periphery that corresponds to the inner periphery of the inner holes of the substrates in order to precisely align the substrates relative to one another.
For a particularly simple and economical embodiment of the invention, the noses are pivotably mounted on the centering pin. The noses are advantageously biased outwardly by at least one biasing unit in order to achieve a controlled joining together of the substrates. In this connection, the biasing unit is preferably provided with at least one spring.
Pursuant to one specific embodiment of the invention, the noses are movable toward the pin by exerting pressure upon the substrates, so that the substrates can be joined together in a controlled manner by a simple exertion of pressure.
Pursuant to an alternative specific embodiment of the invention, an actuating element that radially moves the noses is provided and can control the movement of the noses. For this purpose, the noses are preferably embodied as lever arms in order to enable a simple actuation thereof. The actuating element is advantageously introducible between the noses and has a conical configuration in order to enable a uniform movement of the noses in a simple manner. For a good gliding movement between the noses and the actuating element, the ends of the noses are advantageously rounded off.
Pursuant to a further specific embodiment of the invention, the biasing of the noses can be varied in order to enable a controlled gliding of the substrates along the outer surfaces of the noses. Advantageously, a conical or tapered element disposed in the pin is provided that is movable counter to a biasing. In this connection the tapered element is preferably movable against a spring.
In order to provide a controllable biasing of the noses, a biasing element is preferably provided between the tapered element and the noses. The outwardly directed biasing of the noses is in this connection preferably variable via a movement of the tapered element.


REFERENCES:
patent: 2705968 (1955-04-01), Mazzeo
patent: 3892415 (1975-07-01), Takahashi et al.
patent: 4701896 (1987-10-01), Allebest et al.
patent: 4704181 (1987-11-01), Kubo
patent: 4768185 (1988-08-01), Camerik
patent: 5197056 (1993-03-01), Van Heusden et al.
patent: 5888433 (1999-03-01), Amo
patent: 6179031 (2001-01-01), Rack et al.
patent: 0 793 224 (1997-09-01), None
patent: 64-052238 (1989-02-01), None
JP 64-052238 Patent abstracts of Japan Feb. 28, 1989.*
JP 01052238 Patent Abstracts of Japan Aug. 24, 1987.
JP 11053769 Patent Abstracts of Japan Aug. 1, 1997.
JP 03157834 Patent Abstracts of Japan Nov. 16, 1989.
JP 09245386 Patent Abstracts of Japan Mar. 7, 1996.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for joining substrates together does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for joining substrates together, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for joining substrates together will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3335840

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.