Apparatus for jet soldering containers

Metal fusion bonding – Including means to apply flux or filler to work or applicator – Solid flux or solid filler

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

228 11, 113 1M, B23K 116

Patent

active

039469301

ABSTRACT:
This disclosure relates to a jet soldering apparatus for applying a jet of solder to a side seam of a can body formed in a bodymaker. The soldering apparatus includes a heated metal block having an elongated cavity which terminates in a discharge orifice. Solder wire is fed into the cavity and is heated therein by means of electrical heaters connected to the block. The cavity has an inlet in the form of a bore which substantially corresponds to the diameter of the solder wire so that the solder wire prevents any back flow of molten solder through the inlet. The cavity is also in the form of a bore generally conforming to the diameter of the solder wire and is of a length to make certain that the solder wire is fully melted before it reaches the discharge orifice. Feed means are provided to intermittently feed the solder wire in accordance with the presentation of a can body to the discharge orifice. The feed means include a reciprocating chuck and a staionary chuck which act in unison. The reciprocating chuck is driven by a cam actuated by the drive system of the bodymaker. Further, there is incorporated in the system means for moving the reciprocating chuck out of the effective range of the cam so that the solder feeding mechanism may be selectively rendered inoperative.

REFERENCES:
patent: 1623293 (1927-04-01), Williams et al.
patent: 3003049 (1961-10-01), Thomas
patent: 3707258 (1972-12-01), Schlitt
patent: 3797725 (1974-03-01), Mori et al.
patent: 3852565 (1974-12-01), Kager

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for jet soldering containers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for jet soldering containers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for jet soldering containers will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-516267

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.