Apparatus for interconnecting an integrated circuit device to a

Details Apparatus for interconnecting an integrated circuit device to a Apparatus for interconnecting an integrated circuit device to a

1995-11-13

1996-11-05

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

62 37, 165 804, 361776, 361789, 439 73, H05K 720

Patent

active

055724078

ABSTRACT:
Apparatus for interconnecting an integrated circuit device, such as an infrared device, having a plurality of leads to a multilayer printed wiring board having a plurality of interconnects. The apparatus comprises a flexprint circuit having a plurality of interconnects that are configured to mate with the plurality of interconnects on the printed wiring board. The flexprint circuit has wrinkles formed along its surface that form a spring, and a plurality of printed circuit leads that are coupled between the leads of the integrated circuit device and the interconnects. Fastening members is provided for forcibly interconnecting the respective pluralities of interconnects. Respective ends of the flexprint circuit may be folded so that the interconnects contact the interconnects disposed on the printed wiring board. A thermoelectric cooler may be provided for cooling an infrared integrated circuit device, that is coupled through an opening disposed in the flexprint circuit through which the thermoelectric cooler projects to contact the infrared device.

REFERENCES:
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patent: 5155661 (1992-10-01), Nagesh
patent: 5157255 (1992-10-01), Kornrumpf
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patent: 5200810 (1993-04-01), Wojnarowski
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patent: 5317479 (1994-05-01), Pai
patent: 5343360 (1994-08-01), Sanwo
patent: 5379187 (1995-01-01), Lee
patent: 5430614 (1995-07-01), Difrancesco

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