Apparatus for integrated circuit assembly operations

Heating – Heat generator with an associated work support or heat... – Means moving or guiding work relative to heat emitter during...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

165185, 219210, 219385, 219388, F24J 300, F28F 700, H05B 100, F27D 1100

Patent

active

046262067

ABSTRACT:
An integrated circuit chip is alloyed to a ceramic header for a standard semiconductor package in an elongated preheater fixture. The fixture has a heating position laterally spaced from a loading position, with slots running from the loading to heating positions accommodating the pins of the header. The slots also function as fins to radiate heat so that a temperature gradient is created between loading and heating positions. As the headers slide from the loading position along the length of the fixture, the headers are heated to the bonded temperature without producing undue thermal stress.

REFERENCES:
patent: 1919950 (1933-07-01), Kerr
patent: 3566514 (1971-03-01), Szumigala
patent: 4310304 (1982-01-01), Decrulle
patent: 4374316 (1983-02-01), Inamori et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for integrated circuit assembly operations does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for integrated circuit assembly operations, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for integrated circuit assembly operations will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2290501

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.