Apparatus for inspecting solder portion of a circuit board

Radiant energy – Photocells; circuits and apparatus – Optical or pre-photocell system

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Details

250563, 356376, 356394, G01N 2186, G01B 1124

Patent

active

051031051

ABSTRACT:
A beam of light is applied to a surface of a circuit board provided with at least one solder portion. The light beam scans the surface of the circuit board. Height data are derived from a portion of the light beam which is scattered at the surface of the circuit board. The height data represent a height of a currently-scanned point of the surface of the circuit board. The height data are accumulatively added for the solder portion. A variation in the height data is calculated. The accumulative addition of the height data is executed and suspended in response to the calculated variation in the height data. A decision is made as to whether the solder portion is acceptable or unacceptable on the basis of a result of the accumulative addition.

REFERENCES:
patent: 4900940 (1990-02-01), Nakamura
patent: 4910690 (1990-03-01), Fujita
patent: 4911550 (1990-05-01), Hisakuni
patent: 4911551 (1990-03-01), Morander
patent: 4983827 (1991-01-01), Ikegaya et al.
patent: 4988202 (1991-01-01), Nayar et al.
patent: 5011960 (1991-04-01), Ando et al.

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