Image analysis – Applications – Manufacturing or product inspection
Patent
1994-09-15
1997-03-04
Boudreau, Leo
Image analysis
Applications
Manufacturing or product inspection
382147, 382150, 382257, 348126, G06K 903, H04N 718
Patent
active
056088167
ABSTRACT:
Pieces of feature information in a bi-level image such as a width, a branching point and an ending point of a wiring pattern are detected in a design rule checking section according to a micro inspection to find out pieces of feature information departing from a design rule. Also, feature codes in the bi-level image such as a corner of the wiring pattern are detected in a specific shape detecting section according to a macro inspection. The feature information are compared with pieces of referential feature information pertaining to a non-defective wiring pattern in a first comparing and judging section to judge whether the wiring pattern indicated by the feature information is defective or non-defective. The feature codes are compared with referential feature codes pertaining to a non-defective wiring pattern in a second comparing and judging section to judge whether the wiring pattern indicated by the feature codes is defective or non-defective. Therefore, defective types and portions of the wiring pattern can be detected by performing the macro inspection and the micro inspection in parallel without dividing the wiring pattern into processed regions.
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Kawahara Toyoki
Kawakami Hidehiko
Kawamura Hideaki
Maruyama Yuji
Yamamoto Atsuharu
Boudreau Leo
Davis Monica S.
Matsushita Electric - Industrial Co., Ltd.
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