Apparatus for inspecting a semiconductor device

Optics: measuring and testing – With sample preparation

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H01L 2166

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active

053010027

ABSTRACT:
An inspecting apparatus is provided by which a cross section of a semiconductor device to be inspected can be easily obtained. The inspection apparatus includes a first microscope for specifying a portion where the inspection of a cross section is to be effected, a rotary grinder for grinding the portion specified by the first microscope, a second microscope for monitoring the portion ground by the rotary grinder, and a stage for fixing the semiconductor device movable relative to the first and second microscopes and the rotary grinder.

REFERENCES:
patent: 4818169 (1989-04-01), Schram
patent: 5028780 (1991-07-01), Kaito et al.
IBM Technical Disclosure Bulletin, vol. 31, No. 10, Mar. 1989 pp. 474-479.
Japanese Abstracts of Japan No. JP 1254845, Publication Date Nov. 10, 1989 Hidehiko et al, Method and Device for Inspecting Semiconductor Element.
Japanese Abstracts of Japan No. 62-87838, Publication date Apr. 1987 Ueda, Specimen Preparing Jig for Observing Cross-Section of IC Chip.

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