Apparatus for injection molding a foamed resin product having a

Static molds – Including electric heating means

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264 25, 264 455, 26432816, 264334, 264DIG83, 425444, 425548, 425552, 425817R, B29F 108, B29D 2700

Patent

active

044961316

ABSTRACT:
The invention comprises a method and apparatus to quickly heat a mold cavity surface or portions thereof just prior to the injection of a foamable plastic resin. The apparatus comprises one or more thin metal surface sheets or bands of high electrical resistivity in the mold cavity covering those portions of the mold where a smooth surface finish on the product is desired. In an alternative form the surface sheets may be plated or sprayed metal of high resistivity on a layer of thin electrically non-conducting plastic in turn adhered to the mold cavity surface.
The thin metal surface sheet is resistance heated approximately 300.degree. F. in a few seconds or less by a low voltage high current source of electric power just prior to the injection of the foamable plastic. The high current passing through the metal of high resistivity causes conversion of electrical energy into sensible heat very quickly to accomplish quick heating of the mold cavity surface sheet. The low voltage eliminates the need for substantial electrical insulation between the thin metal surface sheet and the bulk metal of the mold. Where steel molds and steel surface sheets are employed, the normal oxide coating on the steel serves as the insulation at the interface of the surface sheet and the mold.
To reduce or minimize arcing in the electrical switch gear employed to momentarily connect the high current low voltage source to the surface sheet, a water cooled electric heating pipe bypass is employed as an electrical energy sink during the portion of the molding process that does not employ heating of the surface sheet.

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patent: 2979773 (1961-04-01), Bolstad
patent: 2984887 (1961-05-01), Thiess
patent: 3173175 (1965-03-01), Lemelson
patent: 4201742 (1980-05-01), Hendry
patent: 4338068 (1982-07-01), Suh et al.

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