Apparatus for incremental movement of die frame

Metal fusion bonding – Including means to force or clamp work portions together... – Work portion comprises electrical component

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228 47, 29203P, 324 725, 324158P, 219 79, B23K 3704

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active

039499260

ABSTRACT:
Apparatus for moving a frame of the type for supporting a plurality of integrated circuit chips or die members wherein the frame on a track is moved incrementally along the same by one or both of a pair of pawls pivotally mounted below the track and normally projecting through the plane of the track and into openings in the frame. A reciprocal drive means coupled to the pawls causes the latter to reciprocate, so that the pawls, as they move in reverse, pivot downwardly in the frame and into second frame openings, whereupon the pawls are urged forwardly and they, in turn, advance the frame through a predetermined distance. If the apparatus is used as a die bonder, an improved heat shield is provided for the heater element. Also, an improved die holder is disposed adjacent to and above the heater element. If the apparatus is used as a die test unit, an improved test probe is provided wherein test leads move in engagement with terminals of a die after the die frame has been incrementally advanced.

REFERENCES:
patent: 3051026 (1962-08-01), Da Costa
patent: 3339704 (1967-09-01), Clark et al.
patent: 3477627 (1969-11-01), Webers
patent: 3583063 (1971-06-01), Growney
patent: 3611061 (1971-10-01), Segerson
patent: 3613001 (1971-10-01), Hostetter
patent: 3696985 (1972-10-01), Herring et al.
patent: 3858784 (1974-01-01), Diepeveen

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