Abrading – Precision device or process - or with condition responsive... – By optical sensor
Reexamination Certificate
2005-08-16
2005-08-16
Hail, III, Joseph J. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
By optical sensor
C451S008000, C451S041000, C451S285000, C451S286000, C451S287000, C451S288000, C451S296000, C451S297000, C451S301000
Reexamination Certificate
active
06929530
ABSTRACT:
Polishing pads, planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies. The polishing pads, for example, can be web-format pads, and the planarizing machines can be web-format machines. In a typical application, the web-format machines have a pad advancing mechanism and stationary table with a first dimension extending along a pad travel path, a second dimension transverse to the first dimension, and an illumination site from which a laser beam can emanate from the table. The pad advancing mechanism moves the pad along the pad travel path to replace worn portions of the pad with fresh portions. In one embodiment of the invention, a web-format polishing pad includes a planarizing medium and an optical pass-through system having a plurality of view sites through which a light beam can pass through the pad. The planarizing medium can have a planarizing surface configured to engage the substrate assembly and a backside to face towards the table. The view sites of the optical pass-through system extend along the pad in a direction generally parallel to the pad travel path so that a view site is aligned with the illumination site on the table as the pad moves across the table.
REFERENCES:
patent: 5337144 (1994-08-01), Strul et al.
patent: 5413941 (1995-05-01), Koos et al.
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5439551 (1995-08-01), Meikle et al.
patent: 5643050 (1997-07-01), Chen
patent: 5648847 (1997-07-01), Ebbing
patent: 5667424 (1997-09-01), Pan
patent: 5700180 (1997-12-01), Sandhu et al.
patent: 5730642 (1998-03-01), Sandhu et al.
patent: 5834375 (1998-11-01), Chen
patent: 5851135 (1998-12-01), Sandhu et al.
patent: 5872633 (1999-02-01), Holzapfel et al.
patent: 5934974 (1999-08-01), Tzeng
patent: 5948203 (1999-09-01), Wang
patent: 5997384 (1999-12-01), Blalock
patent: 6000996 (1999-12-01), Fujiwara
patent: 6045439 (2000-04-01), Birang et al.
patent: 6074517 (2000-06-01), Taravade
patent: 6108091 (2000-08-01), Pecen et al.
patent: 6121147 (2000-09-01), Daniel et al.
patent: 6179709 (2001-01-01), Redeker et al.
patent: 6241847 (2001-06-01), Allman et al.
patent: 6254459 (2001-07-01), Bajaj et al.
patent: 6285035 (2001-09-01), Taravade
patent: 6323046 (2001-11-01), Agarwal
patent: 6426232 (2002-07-01), Litvak
patent: 6454630 (2002-09-01), Tolles
patent: 6458014 (2002-10-01), Ihsikawa et al.
patent: 6607422 (2003-08-01), Swedek et al.
patent: 6612901 (2003-09-01), Agarwal
patent: 2001/0044261 (2001-11-01), Elledge
Erkanat, Judy, “Applied Materials' Mirra chemical mechanical polishing system,”Electronic News 41(2094): p. 1, 1991.
Applied Materials, “Dielectric Deposition,” http://www.appliedmaterials.com/products/pdd.html, printed Mar. 2, 1999.
Dorsey & Whitney LLP
Hail III Joseph J.
McDonald Shantese
Micro)n Technology, Inc.
LandOfFree
APPARATUS FOR IN-SITU OPTICAL ENDPOINTING ON WEB-FORMAT... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with APPARATUS FOR IN-SITU OPTICAL ENDPOINTING ON WEB-FORMAT..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and APPARATUS FOR IN-SITU OPTICAL ENDPOINTING ON WEB-FORMAT... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3520817