Apparatus for improving the power dissipation of a semiconductor

Details Apparatus for improving the power dissipation of a semiconductor Apparatus for improving the power dissipation of a semiconductor

1995-10-05

1997-07-08

Tolin, Gerald P.

Earth working

Convertible; or changeable by disassembly or assembly

Changeable by disassembly or assembly

361719, 361794, H05K 720

Patent

active

056463731

ABSTRACT:
An apparatus for improving the power dissipation of a semiconductor device surface mounted on a printed circuit board having at least a top printed circuit board layer and a bottom printed circuit board layer is provided. The apparatus includes a first pad of metallic material connected to a top surface of the top printed circuit board layer. The semiconductor device is connected to the first pad. A second pad of metallic material is connected a to the top surface of at least one of the top and bottom printed circuit board layers, wherein the second pad is electrically isolated from the semiconductor device. The apparatus also includes at least one thermal via for heat transfer through the printed circuit board layers thermally coupled to the thermal pad. A heat sink is thermally coupled to the at least one thermal via.

REFERENCES:
patent: 3686533 (1972-08-01), Garnier et al.
patent: 4729061 (1988-03-01), Brown
patent: 4731701 (1988-03-01), Kuo
patent: 4739448 (1988-04-01), Rowe et al.
patent: 4941067 (1990-07-01), Craft
patent: 4963697 (1990-10-01), Peterson
patent: 5119174 (1992-06-01), Chen
patent: 5173844 (1992-12-01), Adachi et al.
patent: 5347091 (1994-09-01), Schroeder
patent: 5506755 (1996-04-01), Miyagi

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