Apparatus for improving flatness of polished wafers

Details Apparatus for improving flatness of polished wafers Apparatus for improving flatness of polished wafers

1980-03-27

1982-02-02

Whitehead, Harold D.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51235, B24B 704

Patent

active

043132847

ABSTRACT:
Apparatus for improving polished wafer flatness such as slices of semiconductor materials through mounting of the wafers onto a deformable thin disc carrier which is mounted through a resilient device to a rotable pressure plate, the combined mounting being rotably engageable with a rotable turntable supported polishing surface, the turntable having an axis of rotation to edge bow away from the mounted wafers. The carrier is deformed to a concave shape opening toward the bowed table; thus permitting the mounted wafers to achieve through rotation polishing, uniformly improved flatness.

REFERENCES:
patent: 2241478 (1941-05-01), Remington
patent: 3170273 (1965-02-01), Walsh
patent: 3475867 (1969-11-01), Walsh
patent: 3611654 (1971-10-01), Weber
patent: 3693301 (1972-09-01), Lemaitre
patent: 3747282 (1973-07-01), Katzke
patent: 3977130 (1976-08-01), Degner

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