Apparatus for improving coupling across plane...

Details Apparatus for improving coupling across plane... Apparatus for improving coupling across plane...

2007-10-16

2007-10-16

Dinh, Tuan T. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S257000, C361S794000

Reexamination Certificate

active

10329188

ABSTRACT:
The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout, formed on a voltage reference plane. A conductive layer overlies the discontinuity. The conductive layer has a first portion connected to the underlying reference plane and a second portion spanning the discontinuity. The first portion is connected to the reference plane using a slot or vias. And the conductive layer has a third portion extending over the reference plane but remaining disconnected from it. The conductive layer might be graphite or carbon black.

REFERENCES:
patent: 4520228 (1985-05-01), Hoffmann
patent: 5357050 (1994-10-01), Baran et al.
patent: 6219255 (2001-04-01), Teshome
patent: 6349038 (2002-02-01), Hailey
patent: 6392898 (2002-05-01), Asai et al.
patent: 6779262 (2004-08-01), Gales et al.
patent: 2002/0156538 (2002-10-01), Chang

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