Apparatus for improving a sputtering process

Details Apparatus for improving a sputtering process Apparatus for improving a sputtering process

1981-04-17

1983-07-26

O'Keefe, Veronica

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

204192R, 204192SP, 204192M, C23C 1500

Patent

active

043953239

ABSTRACT:
The present invention provides, in a sputtering apparatus, an anode means interposed between the cathode and the substrate (upon which material is to be deposited) which acts to intercept electrons so that they do not impinge on the substrate and which is formed to permit the material dislodged from the cathode (by impinging ions) to pass beyond the anode and be deposited on the substrate. While the present invention can be usefully employed without the aid of a magnetic field, in a preferred embodiment, the present invention is made part of a planar magnetron.

REFERENCES:
patent: 3526584 (1970-09-01), Shaw
patent: 3897325 (1975-07-01), Aoshima et al.
patent: 4006073 (1977-02-01), Welch
patent: 4166018 (1979-08-01), Chapin

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