Apparatus for improved power distribution in wirebond...

Details Apparatus for improved power distribution in wirebond... Apparatus for improved power distribution in wirebond...

2009-04-06

2010-06-01

Le, Thao P. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257SE21508

Reexamination Certificate

active

07727801

ABSTRACT:
A semiconductor package comprising a die adjacent a substrate, a supporting plate adjacent the die, and a conducting plate abutting the supporting plate and electrically coupled to a metal apparatus adjacent the substrate and the die using a plurality of bond wires. The metal apparatus supplies power to the conducting plate.

REFERENCES:
patent: 6667546 (2003-12-01), Huang et al.
patent: 6873040 (2005-03-01), Howard et al.
patent: 6979909 (2005-12-01), Shinohara
patent: 7291928 (2007-11-01), Yamada et al.
patent: 2001/0050422 (2001-12-01), Kishimoto et al.
patent: 2003/0089983 (2003-05-01), Huang et al.

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