Apparatus for improved power distribution in wirebond...

Details Apparatus for improved power distribution in wirebond... Apparatus for improved power distribution in wirebond...

2006-12-19

2006-12-19

Tran, Thien F. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S692000, C257S693000

Reexamination Certificate

active

07151309

ABSTRACT:
A semiconductor package comprising a die adjacent a substrate, a supporting plate adjacent the die, and a conducting plate abutting the supporting plate and electrically coupled to a metal apparatus adjacent the substrate and the die using a plurality of bond wires. The metal apparatus supplies power to the conducting plate.

REFERENCES:
patent: 6064113 (2000-05-01), Kirkman
patent: 6703698 (2004-03-01), Huang et al.

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