Apparatus for improved air flow through a computer chassis

Details Apparatus for improved air flow through a computer chassis Apparatus for improved air flow through a computer chassis

1997-05-30

1999-04-06

Tolin, Gerald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

211 4117, 361796, 454184, H05K 720

Patent

active

058926542

ABSTRACT:
A computer system having an air cooling path includes a motherboard, a circuit board having an edge connector for mounting onto the motherboard, and a chassis defining an interior for containing the circuit board and motherboard. The chassis includes a rear panel having an inset access for accessing the circuit board, where the inset access is spaced inwardly from the rear panel. The computer system further includes an interior panel (within the interior of the chassis) that is connected to the rear panel at a connection location on the rear panel. The connection location is spaced apart on the rear panel from the inset access. The motherboard is mounted to the interior panel, while the rear panel defines a vent between the inset access and the connection location. The interior panel, motherboard, and vent define the air cooling path across the circuit board.

REFERENCES:
patent: 5218514 (1993-06-01), Huynh et al.
patent: 5243493 (1993-09-01), Jeng
patent: 5297004 (1994-03-01), Mazura
patent: 5375038 (1994-12-01), Hardt
patent: 5435362 (1995-07-01), Winkler
patent: 5446619 (1995-08-01), Madsen et al.
patent: 5564930 (1996-10-01), Yu
patent: 5684674 (1997-11-01), Yin
"Printed Circuit Card Restraint Mechanism", IBM Technical Disclosure Bulletin, vol. 36, No. 6B, Jun. 1, 1993, pp. 527-528.
"Air Baffle For Planar Memory Cooling", IBM Technical Disclosure Bulletin, vol. 35, No. 5, Oct. 1, 1992, pp. 235-236.

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