Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2007-11-27
2007-11-27
Graybill, David E. (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C438S127000, C438S422000, C438S456000, C438S977000, C257SE23128, C257SE23191, C257SE21502
Reexamination Certificate
active
10992627
ABSTRACT:
Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a photo-resist material structure surrounding the micromechanical structure to form a cavity together with the substrate between the substrate and the photo-resist material structure, wherein the cavity separates the micromechanical structure and the photo-resist material structure and has an opening, and a closure for closing the opening to close the cavity.
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Franosch Martin
Meckes Andreas
Nessler Winfried
Oppermann Klaus-Gunter
Dickstein , Shapiro, LLP.
Graybill David E.
Infineon - Technologies AG
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