Apparatus for holding substrate to be polished and apparatus and

Abrading – Abrading process – Glass or stone abrading

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451 63, 451288, 451289, 451290, B24B 502, B24B 2904, B24B 100

Patent

active

057919739

ABSTRACT:
An elastic polishing pad is adhered to the top face of a rotatable table. Above the table is provided a substrate holding apparatus for holding a substrate. The substrate holding apparatus comprises a rotary shaft, a substrate holding head in the form of a disc which is provided integrally with the lower edge of the rotary shaft, a sealing member in the form of a ring which is made of an elastic material and fastened to the peripheral portion of the lower face of the substrate holding head, and a guiding member in the form of a ring which is fastened to the back face of the substrate holding head to be located outside the sealing member. A fluid under pressure is introduced into a fluid flow path formed in the rotary shaft from one end thereof and supplied to a space from the other end of the fluid flow path so as to press the substrate against the polishing pad.

REFERENCES:
patent: 2998680 (1961-09-01), Lipkins
patent: 3731435 (1973-05-01), Boettcher et al.
patent: 4598502 (1986-07-01), Lombard
patent: 4954141 (1990-09-01), Takiyama et al.
patent: 5441444 (1995-08-01), Nakajima
patent: 5449316 (1995-09-01), Strasbaugh
patent: 5476414 (1995-12-01), Hirose et al.
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5605488 (1997-02-01), Ohashi et al.
Research Disclosure, Feb. 1991, No. 322, p. 95 "Pressure Wafer Holder for Uniform Polishing".

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