Apparatus for holding electrical or electronic components during

Metal fusion bonding – With means to handle work or product

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269903, 269 37, 118503, 211132, B23K 3704

Patent

active

047475323

ABSTRACT:
A carrier for components to be soldered includes an upper frame pivotally connected to a lower frame. The upper frame includes longitudinal grid members interlocked with transverse grid members to define recessed zones with stepped corners to locate the components. The lower frame has slidably mounted strips with projections which engage the components when the lower frame is pivoted to a closed condition.

REFERENCES:
patent: 3223406 (1965-12-01), Traeger
patent: 4473455 (1984-09-01), Dean et al.
patent: 4489923 (1984-12-01), Barressi et al.
patent: 4527620 (1985-07-01), Pedersen et al.
patent: 4556776 (1985-12-01), Duncan
patent: 4677937 (1987-07-01), Tee
IBM Technical Disclosure Bulletin, vol. 19, No. 9, Feb. '77, p. 3319.

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