Apparatus for holding a testing substrate in a semiconductor waf

Details Apparatus for holding a testing substrate in a semiconductor waf Apparatus for holding a testing substrate in a semiconductor waf

1995-09-29

1998-03-17

Karlsen, Ernest F.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324754, G01R 3102

Patent

active

057291497

ABSTRACT:
An apparatus(19) for holding a testing substrate in a wafer prober (16) has a plate (34) hinged to a head stage (18) of the equipment. The plate has two concentric openings to form a ledge (35) for holding the testing substrate (10). Additionally, the ledge has two asymmetrically placed locating pins (38) to allow automatic alignment of the testing substrate which has corresponding alignment holes. A latch (36) locks the plate against the head stage to securely fix the testing substrate in place so that it can make and maintain contact with a pogo pin area (26) on the head stage. The tester also has a wafer support chuck (20) upon which a semiconductor wafer (22) is placed with its active surface up. The head stage of the tester is closed so that the testing substrate contacts the active surface of the semiconductor wafer, and electrical testing may then be performed on the semiconductor wafer.

REFERENCES:
patent: 4138186 (1979-02-01), Long et al.
patent: 4812754 (1989-03-01), Tracy et al.
patent: 4829241 (1989-05-01), Maelzer
patent: 5055777 (1991-10-01), Bonelli et al.
patent: 5172053 (1992-12-01), Itoyama
patent: 5325052 (1994-06-01), Yamashita
patent: 5436567 (1995-07-01), Wexler et al.
patent: 5546012 (1996-08-01), Perry et al.

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