Apparatus for holding a part in a wave soldering machine

Details Apparatus for holding a part in a wave soldering machine Apparatus for holding a part in a wave soldering machine

1985-10-29

1986-09-30

Godici, Nicholas P.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

118500, 118503, 228 57, B23K 108

Patent

active

046142940

ABSTRACT:
An apparatus for holding an IC device for tinning the leads in a wave soldering machine is disclosed. The apparatus utilizes a pair of beveled surfaces, one on each side of the lead to be tinned, to limit the extent of penetration of the lead into the molten solder. The beveled surfaces are made of a material which cannot be wet by the molten solder, therefore, surface tension of the solder will tend to limit penetration of the molten solder into the area defined by the beveled surfaces.

REFERENCES:
patent: 2935962 (1957-08-01), Deitrick et al.
patent: 3713876 (1973-01-01), Lavric
patent: 4342915 (1982-03-01), Wachs
patent: 4421265 (1983-12-01), Boyer et al.
patent: 4489923 (1984-12-01), Barresi
patent: 4526129 (1985-07-01), Braden

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