Apparatus for heating injection molding fluid

Plastic article or earthenware shaping or treating: apparatus – Female mold and charger to supply fluent stock under... – With means to heat or cool

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C138S089000, C392S482000

Reexamination Certificate

active

07147458

ABSTRACT:
A heater assembly is described for mounting around a fluid flow channel in an injection molding apparatus. In one version, the heater assembly comprises: an inner tube made of a first heat conductive material having a first coefficient of thermal expansion, the inner tube having a selected longitudinal length, an inner surface, an outer surface; and a first ring having an inner surface engaged around the outer surface of the inner tube along a short selected length of the longitudinal length of the inner tube. The ring comprises a second material having a second coefficient of thermal expansion that is less than the first coefficient of thermal expansion. The assembly also has a heater mechanism that heats the inner tube to a selected elevated temperature. Alternatively, the ring can be made from a shape memory alloy that causes the ring to reduce in diameter when the ring is heated above a threshold temperature.

REFERENCES:
patent: 3535742 (1970-10-01), Marcus
patent: 3780764 (1973-12-01), Geist
patent: 3820928 (1974-06-01), Lemelson
patent: 3861841 (1975-01-01), Hanning
patent: 3952927 (1976-04-01), Schaumburg et al.
patent: 4204906 (1980-05-01), Liu
patent: 4389002 (1983-06-01), Devellian et al.
patent: 4500279 (1985-02-01), Devellian et al.
patent: 4521179 (1985-06-01), Gellert
patent: 4588367 (1986-05-01), Schad
patent: 4592711 (1986-06-01), Capy
patent: 4701292 (1987-10-01), Valyi
patent: 4747770 (1988-05-01), Schmidt
patent: 4755131 (1988-07-01), Schmidt
patent: 4768945 (1988-09-01), Schmidt et al.
patent: 4793795 (1988-12-01), Schmidt et al.
patent: 4863369 (1989-09-01), Schad et al.
patent: 4931234 (1990-06-01), Schad et al.
patent: 4932854 (1990-06-01), Matsuda et al.
patent: 5007821 (1991-04-01), Schmidt
patent: 5009718 (1991-04-01), Schmidt
patent: 5078589 (1992-01-01), Osuna-Diaz
patent: 5141696 (1992-08-01), Osuna-Diaz
patent: 5149547 (1992-09-01), Gill
patent: 5192555 (1993-03-01), Arnott
patent: 5225662 (1993-07-01), Schmidt
patent: 5281374 (1994-01-01), Matsuda et al.
patent: 5288222 (1994-02-01), Wieser
patent: 5356576 (1994-10-01), Fischbach
patent: 5360333 (1994-11-01), Schmidt
patent: 5378139 (1995-01-01), Schad et al.
patent: 5389315 (1995-02-01), Yabushita
patent: 5492467 (1996-02-01), Hume et al.
patent: 5545028 (1996-08-01), Hume et al.
patent: 5554395 (1996-09-01), Hume et al.
patent: 5556582 (1996-09-01), Kazmer
patent: 5591366 (1997-01-01), Schmidt et al.
patent: 5601773 (1997-02-01), Schmidt et al.
patent: 5674439 (1997-10-01), Hume et al.
patent: 5871786 (1999-02-01), Hume et al.
patent: 5885624 (1999-03-01), Katsuta et al.
patent: 5885628 (1999-03-01), Swenson et al.
patent: 5894025 (1999-04-01), Lee et al.
patent: 5916605 (1999-06-01), Swenson et al.
patent: 5930458 (1999-07-01), Yane et al.
patent: 5948448 (1999-09-01), Schmidt
patent: 5948450 (1999-09-01), Swenson et al.
patent: 5954094 (1999-09-01), Base
patent: 5980237 (1999-11-01), Swenson et al.
patent: 6000831 (1999-12-01), Triplett
patent: 6027328 (2000-02-01), Herbst
patent: 6062840 (2000-05-01), Lee et al.
patent: 6254377 (2001-07-01), Kazmer et al.
patent: 6261075 (2001-07-01), Lee et al.
patent: 6261084 (2001-07-01), Schmidt
patent: 6287107 (2001-09-01), Kazmer et al.
patent: 6294122 (2001-09-01), Moss et al.
patent: 6309208 (2001-10-01), Kazmer et al.
patent: 6343921 (2002-02-01), Kazmer et al.
patent: 6343922 (2002-02-01), Kazmer et al.
patent: 6361300 (2002-03-01), Kazmer
patent: 6419870 (2002-07-01), Lee et al.
patent: 6436320 (2002-08-01), Kazmer et al.
patent: 6683283 (2004-01-01), Schmidt

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for heating injection molding fluid does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for heating injection molding fluid, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for heating injection molding fluid will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3715405

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.