Apparatus for heat-treating substrate and method for separating

Details Apparatus for heat-treating substrate and method for separating Apparatus for heat-treating substrate and method for separating

1999-03-04

2000-04-18

Paik, Sang

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

118728, H05B 368, C23C 1600

Patent

active

060518154

ABSTRACT:
In the apparatus for and the method of heat-treating a substrate, the substrate is prevented from bearing any electrostatic charges without fail. A workpiece-carrying platform for carrying the substrate thereon is divided into: a workpiece-carrying platform body forming a major part of the workpiece-carrying platform; and, a lifting/lowering ring plate forming the remaining part of the workpiece-carrying platform. The lifting/lowering ring plate is received in a receiving groove of the workpiece-carrying platform body so as to be capable of being lifted and lowered therein. When the substrate is separated from the workpiece-carrying platform, the lifting/lowering ring plate is first lowered, and then the substrate is lifted by lift pins so that the substrate is lifted in two steps, whereby the contact surface of the substrate with workpiece-carrying platform is separated from the latter stepwise.

REFERENCES:
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patent: 5904779 (1999-05-01), Dhindsa et al.
patent: 5946183 (1999-08-01), Yamada et al.

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