Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-01-27
1998-12-01
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 804, 165185, 174 152, 174 163, 361690, 361704, H05K 720
Patent
active
058447776
ABSTRACT:
An apparatus for cooling an array of PC cards includes a chassis defining a chamber having air holes. A heat sink is mounted to the chassis within the chamber and has a finned surface for transferring heat to the surrounding environment, a finless surface on a side opposite the finned surface, and heat pipes fully enclosed within the heat sink, facilitating conductive heat transfer between the finned and finless surfaces. A backplane mounted to the chassis has at least one connector mechanically and electrically connectable to at least one PC card so that a surface of the at least one PC card is in close proximity to and substantially parallel to the finless surface of the heat sink thus facilitating heat transfer between the at least one PC card and the heat sink.
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AT&T Corp.
Thompson Gregory D.
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