Apparatus for grinding semiconductor wafer

Abrasive tool making process – material – or composition – With carbohydrate or reaction product thereof

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Details

511311, 511313, 511314, 51322, B24B 4900

Patent

active

051136228

ABSTRACT:
An apparatus is provided for grinding a semiconductor wafer, which includes a table having a work stage on which a semiconductor wafer to be ground is placed, at least the work stage being rotatable about an axis, and a grinding wheel which is movable in a direction perpendicular to or parallel to the work stage while being rotated about an axis parallel to the rotational axis of the work stage. In this apparatus, a semiconductor wafer is cooled during grinding. In order to perform cooling, the apparatus has an inlet flow path for guiding cooling liquid to a grinding surface of the grinding wheel, and an outlet flow path for collecting the cooling liquid which flows onto the work stage. The apparatus also includes a temperature detector, disposed in the outlet flow path, for detecting a temperature of the recovered cooling liquid. A rotational speed of the grinding wheel or the rotary table is controlled based on the temperature of the cooling liquid detected by the temperature detector.

REFERENCES:
patent: 3611654 (1971-10-01), Weber
patent: 3905162 (1975-09-01), Lawrence
patent: 4122008 (1978-10-01), Allen
patent: 4450652 (1984-05-01), Walsh
patent: 4471579 (1984-09-01), Bovensiepen
patent: 4481741 (1984-11-01), Bouladon
patent: 4513538 (1985-04-01), Wolters
patent: 4665658 (1987-05-01), Carcey

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