Apparatus for forming solder-film on printed-wiring board

Details Apparatus for forming solder-film on printed-wiring board Apparatus for forming solder-film on printed-wiring board

1994-09-28

1996-04-09

Walberg, Teresa J.

Electric heating

Metal heating

By arc

219 8512, 219 8519, 22818022, 228254, B23K 2600, B23K 306, B23K 3514

Patent

active

055063853

ABSTRACT:
A solder-film forming apparatus for automatically forming a solder-film on a conductive pad of a printed-wiring board. The solder-film forming apparatus includes a mechanism for receiving a solder ball, a suction head provided on a distal end thereof with a holding surface for holding the solder ball and a suction port opening to the holding surface, a suction mechanism for generating a negative pressure in the suction port of the suction head, and a mechanism for moving the suction head. The solder-film forming apparatus further includes a controller having printed-wiring board information in which data including a positional information of the pad on the printed-wiring board is preset and controlling a movement of the suction head by the head moving mechanism and an operation of the suction mechanism in accordance with the printed-wiring board information. A laser beam is irradiated from a laser unit to the solder ball placed on the conductive pad of the printed-wiring board and as a result, the solder ball is fused to form a solder-film. The positional relation between the laser unit and the pad is detected by a camera and corrected.

REFERENCES:
patent: 4871110 (1989-10-01), Fukasawa et al.
patent: 5088639 (1992-02-01), Gondotra et al.
patent: 5122635 (1992-06-01), Knodler et al.
patent: 5284287 (1994-02-01), Wilson et al.

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