Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Female mold type means
Patent
1997-12-11
1999-06-22
Davis, Robert
Plastic article or earthenware shaping or treating: apparatus
Distinct means to feed, support or manipulate preform stock...
Female mold type means
425190, 425588, B29C 4514, B29C 4532
Patent
active
059141360
ABSTRACT:
The present invention relates to an apparatus for forming semiconductor chip packages which is able to compensate for the flatness of substrates and the true straightness of edges of substrates, which substrates are inserted in molds in a forming process of semiconductor chip packages. According to the present invention, the semiconductor package strips excellent in surface flatness and side straightness of a substrate can be manufactured, because the thickness deviation and the side nonuniformity of a substrate can be compensated for in the resin molding process of the semiconductor package by use of a forming apparatus which comprises the individual cavity blocks, elastically mounted so as to float up and down, and the elastic pressing members, mounted on one end of the upper and lower chases. Therefore, the flashes owing to the defective substrates as encountered in a conventional art can be prevented, whereby mass production of semiconductor chips with the high precision and the excellent quality can be realized.
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Davis Robert
Trimecs Co. Ltd.
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