Apparatus for forming modular sockets using flexible...

Details Apparatus for forming modular sockets using flexible... Apparatus for forming modular sockets using flexible...

2007-03-20

2007-03-20

Duverne, J. F. (Department: 2839)

Electrical connectors

With insulation other than conductor sheath

Plural-contact coupling part

Reexamination Certificate

active

11204081

ABSTRACT:
A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.

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IBM Journal of Research & Development vol. 41, No. 1/2 Optical lithography, “Negative Photoresists for Optical Lithography” Oct. 16, 1997.

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