Apparatus for forming leads of a semiconductor device

Plastic article or earthenware shaping or treating: apparatus – Mold opening and closing means and segmented female mold

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Details

100282, 100292, 100257, 83530, 83527, 83632, 83626, 83283, 72450, B28B 300, B29C 3320

Patent

active

049233866

ABSTRACT:
A lead forming apparatus suitable for use in forming the leads of a semiconductor device is disclosed. The apparatus has a housing for supporting a stationary lower mold half, a support plate arranged to freely move with respect to the housing for supporting a movable mold half in opposition to the lower mold half, a moving device for moving the support plate to cause the movable mold half toward and away from the lower mold half, and an adjusting device for adjusting the position of the support plate with respect to the moving device. The moving device has a crankshaft, a driving device for rotating the crankshaft about its axis, and a coupler transmitting the rotation of the crankshaft to the support plate as a linear motion. The apparatus having the above-described arrangement can be operated with a reduced noise level and a reduced impact and, furthermore, achieves good operability.

REFERENCES:
patent: 2869453 (1959-01-01), Horn
patent: 4480538 (1984-11-01), Yoshida
patent: 4677908 (1987-07-01), Imanishi et al.
"Press Manufacturing Handbook", by the Japan Plastic Manufacturing Association, published by Maruzen Ltd., pp. 772-775.

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