Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Chamber enclosing work during bonding and/or assembly
Patent
1993-07-08
1995-02-21
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Chamber enclosing work during bonding and/or assembly
100 90, 100 93P, 1565831, 156494, 425388, B32B 3120, B30B 500
Patent
active
053912535
ABSTRACT:
A press forms a long, thin laminated strip of plastic, metal and fiberglass. The uncured laminate will be laid up in a housing which has sidewalls and a base. A partition is placed over the laminate. The partition seals to sidewalls of the housing and is moveable relative to the housing. The partition divides the cavity of the housing into an upper section and a lower section. The lower section is evacuated. Gas or fluid pressure is applied to the upper section. Heat is applied to the housing to cure the laminate while the pressure is maintained. Tension is applied longitudinally to the laminate during the process.
REFERENCES:
patent: 2730281 (1956-01-01), Prohaska
patent: 2978806 (1961-04-01), Herbert, Jr.
patent: 2990872 (1961-07-01), Gaby
patent: 3817806 (1974-06-01), Anderson et al.
patent: 3936336 (1976-02-01), Phillips
patent: 4078962 (1978-03-01), Krueger
patent: 4290838 (1981-09-01), Reavill et al.
patent: 4777721 (1988-10-01), Choinski
patent: 4806195 (1989-02-01), Namysl
patent: 4884601 (1989-12-01), Hatakeyama
patent: 5108532 (1992-04-01), Thein et al.
patent: 5182121 (1993-01-01), Miyashita
Howell Richard E.
Johnson Weldon M.
Ball Michael W.
Bradley James E.
Yoder Michele K.
LandOfFree
Apparatus for forming laminates does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus for forming laminates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for forming laminates will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1927734