Apparatus for forming electrical connections between a semicondu

Details Apparatus for forming electrical connections between a semicondu Apparatus for forming electrical connections between a semicondu

1996-02-29

1998-08-11

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257704, 257734, H01L 2348

Patent

active

057931046

ABSTRACT:
A semiconductor device package containing a semiconductor die uses a platform mounted on an active face of the die. The platform electrically connects to at least one bond pad on the die. A package lid electrically connects to the platform on the die and a package case connection. The package case connection is also electrically connected to at least one external connector on the package. The platform and package lid thereby connect the at least one bond pad on the die to the at least one external connector on the package. Using the platform and lid for electrical connections from the semiconductor die bond pads to the external package connector reduce the number of bond fingers required to surround the perimeter of the die. The package lid and platform may, for example, be used for ground or power connections to the die bond pads.

REFERENCES:
patent: 4417392 (1983-11-01), Ibrahim et al.
patent: 4901136 (1990-02-01), Neugebauer et al.
patent: 4954878 (1990-09-01), Fox et al.
patent: 5012323 (1991-04-01), Farnworth
patent: 5095359 (1992-03-01), Tanaka et al.
patent: 5220195 (1993-06-01), McShane et al.
patent: 5223741 (1993-06-01), Bechtel et al.
patent: 5237204 (1993-08-01), Val

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